The thermal–structural analysis of a pin under high accelerated stress screening test

Pins are one of the most common parts of electronic equipment, which play a very important role in it. The reliability of pins is usually evaluated and improved by the high accelerated stress screening (HASS) test. A coupled thermal–structure model of a pin is proposed based on HASS test load in this paper. The pins are simulated commonly as the Euler–Bernoulli beam. At first, the finite-element model of a pin is established to analyze the temperature field and thermal stress stiffness. Then, the coupled thermal–structure equation of a pin is developed in which the additional stiffness matrix is superimposed on the dynamic equation. Last, the coupling equation is solved by the reciprocal iteration of the Galerkin and the Newmark methods. The results are verified by ANSYS simulation and HASS test. It showed that the simulation results are in good agreement with the experimental results, which reveal the correctness of the coupling model and provide the theoretical basis for failure analysis, simulation analysis, and forming reasonable HASS test profile of electronic equipment. It lays the foundation for the validity and safety analysis of HASS test.