Printed circuit board for semiconductor device and method of manufacturing the same

A printed circuit board for a semiconductor device and manufacturing method thereof are provided to obtain a semiconductor device having high reliability by providing a printed circuit board having a conductive pattern including carbon nanotube and to form conductive pattern having a property of being mechanically excellent by plating carbon nanotube having high intensity and coefficient of elasticity, and the excellent heat and conductivity with copper. A printed circuit board(180) for a semiconductor device comprises a substrate, carbon nanotube and conductive wiring. The carbon nanotube is formed on the substrate. The conductive wiring includes the nanotube. The conductive wiring is formed on the upper side and lower surface of the substrate. The substrate comprises a penetration hole(120) passing through the substrate.