Semiconductor processing adhesive tape

A well as comprising a strong adhesion is required when the physical and mechanical separation of the support member, the cleaning liquid for cleaning the adhesive residue that was stuck to the support member to the semiconductor wafer the adhesive even when applied to the agent, without contaminating the semiconductor device by dissolving the adhesive agent, and passes through the laser necessary for the stealth dicing, form a modified layer by the incidence of the laser beam to a semiconductor wafer it is allowed to provide a semiconductor processing adhesive tape which can be singulated semiconductor wafer into semiconductor chips. A semiconductor processing adhesive tape of the present invention is a semiconductor processing adhesive tape radiation-curable pressure-sensitive adhesive layer is formed on at least one surface of the base resin film, the radiation of the pressure-sensitive adhesive layer a contact angle of 25.1 ° to 60 ° to methyl isobutyl ketone before irradiation, parallel light transmittance of light of wavelength 1064nm incident from the substrate resin film side is less than 100% or more 88%. .BACKGROUND