A novel method for chip integration and packaging for millimeter-wave to terahertz band applications

In this paper a novel chip integration and packaging methodology for millimeter-wave to terahertz band applications is demonstrated. The new method is based on peg and socket connection where the line and pads on the MMIC chip mate the lines and pads on the wafer. The socket is micromachined in the wafer and has the exact dimensions of the active chip (peg) with extended membranes to support the lines and pads on the wafer. The lines on the wafer are then transitioned to waveguide using a recently developed grounded-CPW line to waveguide transition. Metalized micro-cylindrical bumps are fabricated on the pads and lines to enhance contact. In order to validate the performance of the proposed integration methodology a prototype is designed and microfabricated at J-band and excellent measured performance is reported in the desired frequency range (220–260 GHz). The new method is a strong candidate for a standardized integration and packaging technique at MMW to THz frequencies and is expected to find a wide range of applications in this area due to its scalability, low fabrication cost, compact form-factor and superb RF performance.