Selective Transfer of Si Thin-Film Microchips for Fluidic Self-Assembly

Fluid self-assembly is one of the promising methods for bonding and integrating micron-order optoelectronic devices on semiconductor chips. In this study, we investigated the fluid self-assembly process using an unprecedented Si thin film and quantitatively evaluated the selectivity in integration by introducing a thermal oxide film. In the thin film separation process, good separation performance from the substrate was achieved by performing SiO 2 layer etching while applying ultrasonic vibration, and the selectivity in integration could be improved by introducing a thermal oxide film to the receiver substrate.