Adhesion Strength and Warpage Behaviors of Advanced Package Substrate by Light-source Irradiation

The semiconductor industry's push toward continued miniaturization and increasing complexity is driving wider adoption of advanced package technology. Advanced package provides potential solution for systems with better performance and more functions at a smaller form factor, lower cost, lower power consumption, and a shorter time to market. Due to these reason, dielectric materials with not only low Dk(Dielectric Constant), Df(Dissipation Factor) but also high resolution to make smaller Via-hole has been becoming used for data server and 5G related areas. To reduce yield loss during the substrate and wafer assembly process, warpage control is becoming even more critical due to increasing number of I/O counts. In this paper, be handled how to improve surface modification on Low-loss material and reduction of substrate warpage with Light-source irradiation.