EXPERIMENTAL AND NUMERICAL SIMULATION STUDY ON THERMAL PERFORMANCES OF A NEW TYPE OF ASSEMBLED WOOD-STRUCTURE WALLBOARDS

In the paper, a new fabricated wood-structure wallboard-dovetail-mortise-and-tenon joint wood-structure wallboard, was presented. In order to explore thermal performances of wood structure wallboards, 5 kinds of wallboard specimens were fabricated, and the average heat transfer coefficient was measured by the temperature control box-heat flowmeter method. Based on the 5 insulation materials, theoretical calculation of thermodynamic performances for the wallboards was conducted, and 5 finite element models were modelled by ANSYS, the thermal performance simulation analysis of composite wallboards was made, the comparisons of the test results with the energy-saving standard limit values and the theoretical calculation values showed that the wallboard with XPS plate internal could meet the cold and cold rural area or urban residential energy-saving regmiments. The experimental values were in good agreement with the two calculated values, and the reliability of thermal performances was verified by each other. Finally, ANSYS was used to simulate the thermal performances of 15 groups of XPS panels with different thickness, and a recommended thermal resistance calculation formula was put forward.