Thermal and power delivery considerations of the 65k pixel 3-D integrated radiation imaging module with through-silicon vias

Single photon counting pixel hybrid detectors are becoming increasingly popular in high energy physics. X-ray detectors for synchrotron applications and medical imaging. They utilize various detector materials and are built using different micro-assembly approaches. Typically readout chips for these detectors have the area of a few cm 2 and are designed to be abutted on 3 sides. Large area detectors with no or minimum dead areas are required by many applications. This paper shows thermal and power supply design considerations of the 3-D integrated 2-chip, 2 cm × 2 cm, plug-in radiation imaging modules fabricated using through-silicon vias and redistribution layer deposition micro-assembly technologies.