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UV Cure Enabled Robust STI Oxide Gap Fill Solution for Thermally Limited Flow in Advanced Logic Devices
UV Cure Enabled Robust STI Oxide Gap Fill Solution for Thermally Limited Flow in Advanced Logic Devices
2016
Sanjay C. Mehta
Richard A. Conti
Thamarai S. Devarajan
Matthew P Wright
Yiping Yao
S. Cohen
Todd Ryan
Thomas J. Haigh
Paul Hall
D. Canaperi
Leo Tai
Keywords:
Oxide
Electrical engineering
Electronic engineering
Engineering
Flow (psychology)
Engineering physics
Correction
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