Integration of Three-Dimensional Macroporous Nanoelectronics with Materials

2018 
Seamless integration of embedded multifunctional electronics with host materials could transfer inactive materials into active systems, which allow the communication between the materials and external environment, and create a smart system [1, 2]. Traditional electronics are planar and rigid, however, most materials and systems in our daily life are three-dimensional (3D) and non-planar.
    • Correction
    • Source
    • Cite
    • Save
    • Machine Reading By IdeaReader
    23
    References
    0
    Citations
    NaN
    KQI
    []