Integration of Three-Dimensional Macroporous Nanoelectronics with Materials
2018
Seamless integration of embedded multifunctional electronics with host materials could transfer inactive materials into active systems, which allow the communication between the materials and external environment, and create a smart system [1, 2]. Traditional electronics are planar and rigid, however, most materials and systems in our daily life are three-dimensional (3D) and non-planar.
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