Scalable packaging platform supporting high-performance 3D chip stacks

Thomas Brunschwiler,Gerd Schlottig,Arvind Sridhar,Antonio La Porta,Ozgur Ozsun,Jonas Zürcher,Rahel Strassle,Luca Del Carro,Pedro A. M. Bezerra

Scalable packaging platform supporting high-performance 3D chip stacks

2017

Thomas Brunschwiler
Gerd Schlottig
Arvind Sridhar
Antonio La Porta
Ozgur Ozsun
Jonas Zürcher
Rahel Strassle
Luca Del Carro
Pedro A. M. Bezerra

The performance and power efficiency of high-end servers benefit from dense system integration. Accordingly, we introduce a scalable packaging platform supporting high-performance chip stacks, as a continuation in server-system density scaling.

Keywords:

Electrical efficiency
System integration
Electronic engineering
Chip
Integrated circuit
Scalability
Three-dimensional integrated circuit
Continuation
Embedded system
Server
Engineering
Stack (abstract data type)

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