Copper-based metallization for ULSI circuits

The feasibility of copper metallization for interconnections in ultra-large scale integrated circuits is under evaluation in the ESPRIT/JESSI project COIN (Copper INterconnections). Research has been performed comprising all basic aspects of copper metallization for integrated circuits, such as development and evaluation of processes for metal deposition and patterning, evaluation of materials which could act as barrier against copper diffusion, electrical testing of the barrier layer performance and finally evaluation of the electromigration performance of copper interconnections.