A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications

F. Bœuf,Sebastien Cremer,N. Vulliet,Thierry Pinguet,Attila Mekis,Gianlorenzo Masini,Lieven Verslegers,Peng Sun,Ali Ayazi,N. K. Hon,Subal Sahni,Y. Chi,B. Orlando,D. Ristoiu,A. Farcy,F. Leverd,Lucile Broussous,D. Pelissier-Tanon,C. Richard,L. Pinzelli,R. Beneyton,Olivier Gourhant,E. Gourvest,Y. Lefriec,D Monnier,P. Brun,M. Guillermet,D. Benoit,K. Haxaire,Jean-Robert Manouvrier,S. Jan,H. Petiton,J.F. Carpentier,T. Quemerais,C. Durand,D. Gloria,Mickael Fourel,Frederic Battegay,Yannick Sanchez,E. Batail,F. Baron,Philippe Delpech,L. Salager,P. De Dobbelaere,B. Sautreuil

A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications

2013

Recently Silicon Photonics has generated an outstanding interest for integrated optical communications. In this paper we describe a 300mm Silicon Photonics platform designed for 25Gb/s and above applications at the three typical communication wavelengths and compatible with 3D integration. Main process features and device results are described.

Keywords:

Optoelectronics
Silicon photonics
Optical communication
Electronic engineering
Silicon on insulator
Hybrid silicon laser
Photonics
Wafer
Wavelength
Physics
multi wavelength

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