Optically transparent heat-resistant nanocomposites based on epoxy resin and silicon dioxide

The curing process was studied for compositions of diepoxide 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, SiO2 nanoparticles with grafted glycidyl groups, and a curing agent based on methyltetrahydrophthalic anhydride. It is shown that optically transparent epoxy composites with higher heat resistance can be obtained in the presence of a nanofiller. The softening temperature T soft of these composites coincides with the onset of thermal degradation at 325°C.