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Etch Process Sensitivity To An Inductively Coupled Plasma Etcher Treated With Fluorine-Based Plasma
Etch Process Sensitivity To An Inductively Coupled Plasma Etcher Treated With Fluorine-Based Plasma
1997
Songlin Xu
Zhiwen Sun
Xueyu Qian
Jerry C. P. Yin
Keywords:
Plasma etcher
Inductively coupled plasma
Plasma
Analytical chemistry
Fluorine
Chemistry
Correction
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