Method for separating semiconductor broken silicon wafers and guide bars

The invention relates to a method for separating semiconductor broken silicon wafers and guide bars, in particular to a method for separating the broken silicon wafers and the guide bars generated in the solar-grade polycrystalline silicon wafer manufacture process. The separating method comprises the following steps of: placing the broken silicon wafers mixed with the guide bars in prepared aqueous solution; after the guide bars float up and the guide bars floating on the surface of the aqueous solution are fished out by a plastic sieve, taking out the broken silicon wafers and flushing with pure water, wherein the compound of the aqueous solution can be any one of 45-80% nitric acid, 20-50% aluminum chloride solution, 30-85% zinc chloride solution, 30-85% stannic chloride, 30-86% ferric chloride solution and 30-83% antimony butter solution; after the broken silicon wafers are taken out and flushed with the pure water, placing the broken silicon wafers in 98% concentrated sulfuric acid for soaking for 3-15min and then taking out. The surfaces of the broken silicon wafers separated by the method are clean, and the guide bars in the broken silicon wafers can be completely removed; the method has low separation cost, low operation difficulty and high efficiency, and moreover, the aluminum chloride solution and the stannic chloride solution can be repeatedly used; and relative to manual separation, a large number of manpower resources can be saved.