Shipping Container Design Improvement Analysis for Drop/Shock Loading

Electronic products are subject to a lot of different types of drop/shock loading during shipping and handling. The huge impact and acceleration would be transmitted to electronic products and its shipping container which will cause mechanical failure of electronic components, such as solder-joint failure, chip-cracking and pad cratering, etc. Therefore, the shipping container of electronic products play a significant role on protecting products safe and place orderly during transportation. The package qualification process requires that it need to pass the system level drop test before shipping, however, this does not always guarantee that the products would stay orderly and safe after system level drop test, and the failure mode of the system level drop test of the whole package includes dislocation failure, crake of shipping container and so on. In order to improve the design of shipping container of electronic products, many types of research have been conducted. The purpose of the present study is to evaluate several different design models with respect to combine different anti-shock structures and connection type between lid and tray by using numerical methods. Data are presented to show the effects of above factors and to highlight the main factor to cause the dislocation failure.