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Ganesh Pandiarajan
Ganesh Pandiarajan
Binghamton University
Composite material
Materials science
Ball grid array
Soldering
Conformal coating
4
Papers
5
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Shipping Container Design Improvement Analysis for Drop/Shock Loading
2021
ECTC | Electronic Components and Technology Conference
Pengcheng Yin
Seungbae Park
Ganesh Pandiarajan
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Impact of Conformal Coating Material on the Long-Term Reliability of Ball Grid Array Solder Joints
2020
IEEE Transactions on Components, Packaging and Manufacturing Technology
Abid-Alrahman Fawzi Abbas
Ganesh Pandiarajan
Satya Iyer
Christopher S. Greene
Daryl Santos
Krishnaswami Srihari
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Impact of Conformal Coating Material on the Long-Term Reliability of Ball Grid Array Solder Joints
2019
Procedia Manufacturing
Abid-Alrahman Fawzi Abbas
Christopher M. Greene
Krishnaswami Srihari
Daryl Santos
Ganesh Pandiarajan
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Effect of pad design (SMD/NSMD), via-in-pad, and reflow profile parameters on voiding during the lead-free solder bumping process
2013
ECTC | Electronic Components and Technology Conference
Ganesh Pandiarajan
Satyanarayan Iyer
Gurudutt Chennagiri
Ross Havens
K. Srihari
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