Solder bumping for flip-chips with an electro-magnetic actuator

This paper reports an actuator for printing solder. Different types of solder can be printed: Sn63Pb37, Sn100, Sn96Ag4, and Sn97Cu3. The primary application of the print head is the field of flip-chip bumping. The advantage in this case is the flexible generation of solder balls on a circuit board without the need of using a screen printing mask.