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Y. H. Hu
Y. H. Hu
IMEC
Materials science
Thermocompression bonding
Composite material
Three-dimensional integrated circuit
Stacking
4
Papers
24
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Process development to enable 3D IC multi-tier die bond for 20μM pitch and beyond
2014
ECTC | Electronic Components and Technology Conference
Y. H. Hu
C. S. Liu
M. T. Chen
M.D. Cheng
H.J. Kuo
M. J. Lii
A. La Manna
Kenneth June Rebibis
Teng Wang
Stefaan Van Huylenbroeck
R. Daily
Giovanni Capuz
Dimitrios Velenis
Gerald Beyer
Eric Beyne
Doug C. H. Yu
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Citations (8)
3D stacking using Cu-Cu direct bonding for 40um pitch and beyond
2012
Electronics System-integration Technology Conference
Y. H. Hu
C. S. Liu
M. J. Lii
A. La Manna
Kenneth June Rebibis
M. Zhao
Eric Beyne
Chen-Hua Yu
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Citations (5)
3D stacking using Cu-Cu direct bonding
2012
DIC | IEEE International D Systems Integration Conference
Y. H. Hu
C. S. Liu
M. J. Lii
Kenneth June Rebibis
Anne Jourdain
A. La Manna
Gerald Beyer
Eric Beyne
Chen-Hua Yu
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Citations (8)
Cu-Cu hybrid bonding as option for 3D IC stacking
2012
IITC | International Interconnect Technology Conference
Y. H. Hu
C. S. Liu
M. J. Lii
Kenneth June Rebibis
Anne Jourdain
A. La Manna
Eric Beyne
Chen-Hua Yu
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Citations (3)
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