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M.D. Cheng
M.D. Cheng
TSMC
Electronic engineering
Materials science
Composite material
Dielectric
Flip chip
3
Papers
11
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Process development to enable 3D IC multi-tier die bond for 20μM pitch and beyond
2014
ECTC | Electronic Components and Technology Conference
Y. H. Hu
C. S. Liu
M. T. Chen
M.D. Cheng
H.J. Kuo
M. J. Lii
A. La Manna
Kenneth June Rebibis
Teng Wang
Stefaan Van Huylenbroeck
R. Daily
Giovanni Capuz
Dimitrios Velenis
Gerald Beyer
Eric Beyne
Doug C. H. Yu
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Citations (8)
Advanced flip-chip package solution for 28nm Si node and beyond
2012
ECTC | Electronic Components and Technology Conference
C. S. Liu
Ching-Fang Chen
C. H. Lee
H.Y. Tsai
Han-Ping Pu
M.D. Cheng
T. H. Kuo
Hsiao-Yun Chen
Chung-Jung Wu
M. J. Lii
Doug C. H. Yu
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Citations (2)
Advanced flip-chip package production solution for 40nm/28nm technology nodes
2010
IEDM | International Electron Devices Meeting
Ching-Wei Chen
C. S. Liu
C. H. Lee
H.Y. Tsai
Han-Ping Pu
K.C. Hsu
H.J. Kuo
M.D. Cheng
Chung-Jung Wu
S.L. Chiu
K.C. Wu
Huan-Neng Chen
Ching-Wen Hsiao
Chih-Hang Tung
M. J. Lii
Douglas Yu
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