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Chung-Jung Wu
Chung-Jung Wu
TSMC
Materials science
Electronic engineering
Chip
Flip chip
Optoelectronics
5
Papers
7
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Ultra High Power Cooling Solution for 3D-ICs
2021
VLSIC | Symposium on VLSI Circuits
Chung-Jung Wu
S. T. Hsiao
J. Y. Wang
W. H. Lin
C. W. Chang
T. L. Shao
C. H. Tung
Doug C. H. Yu
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Ultra High Power Cooling Solution for 3D-ICs
2021
VLSIT | Symposium on VLSI Technology
Chung-Jung Wu
S. T. Hsiao
J. Y. Wang
W. H. Lin
C. W. Chang
T. L. Shao
C. H. Tung
Doug C. H. Yu
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Optimization of solder height and shape to improve the thermo-mechanical reliability of wafer-level chip scale packages
2013
ECTC | Electronic Components and Technology Conference
Su-Chun Yang
Chung-Jung Wu
Da-Yuan Shih
Chih-Hang Tung
Cheng-Chang Wei
Yi-Li Hsiao
Ying-Jui Huang
Douglas Chen-Hua Yu
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Advanced flip-chip package solution for 28nm Si node and beyond
2012
ECTC | Electronic Components and Technology Conference
C. S. Liu
Ching-Fang Chen
C. H. Lee
H.Y. Tsai
Han-Ping Pu
M.D. Cheng
T. H. Kuo
Hsiao-Yun Chen
Chung-Jung Wu
M. J. Lii
Doug C. H. Yu
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Advanced flip-chip package production solution for 40nm/28nm technology nodes
2010
IEDM | International Electron Devices Meeting
Ching-Wei Chen
C. S. Liu
C. H. Lee
H.Y. Tsai
Han-Ping Pu
K.C. Hsu
H.J. Kuo
M.D. Cheng
Chung-Jung Wu
S.L. Chiu
K.C. Wu
Huan-Neng Chen
Ching-Wen Hsiao
Chih-Hang Tung
M. J. Lii
Douglas Yu
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