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H.Y. Tsai
H.Y. Tsai
TSMC
Materials science
Electronic engineering
Flip chip
Dielectric
Composite material
5
Papers
10
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CPI challenges in advanced Si technology nodes
2013
IITC | International Interconnect Technology Conference
C. S. Liu
Han-Ping Pu
Christopher S. Chen
H.Y. Tsai
Chih-Hao Lee
M. J. Lii
Doug C. H. Yu
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Citations (1)
Advanced flip-chip package solution for 28nm Si node and beyond
2012
ECTC | Electronic Components and Technology Conference
C. S. Liu
Ching-Fang Chen
C. H. Lee
H.Y. Tsai
Han-Ping Pu
M.D. Cheng
T. H. Kuo
Hsiao-Yun Chen
Chung-Jung Wu
M. J. Lii
Doug C. H. Yu
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Citations (2)
Wet Clean Induce Pattern Collapse Mechanism Study
2012
Solid State Phenomena
C.C. Yang
C. C. Ko
H. Ou Yang
K.F. Chen
Y.Y. Peng
J.W. Liou
C.C. Chou
H.Y. Tsai
K.C. Lin
S.M. Jeng
H.J. Tao
M. Cao
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Citations (5)
Flip chip power cycling system development and lead free bump power cycling reliability
2012
ECTC | Electronic Components and Technology Conference
Max K. C. Wu
H. Y. Pan
Larry Lin
Christine Chiu
Tulip Chou
Gary Lu
Patrick Liu
Gene Wu
Han-Ping Pu
H.Y. Tsai
Bill Kiang
Kenneth Wu
M. J. Lii
C. H. Yu
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Advanced flip-chip package production solution for 40nm/28nm technology nodes
2010
IEDM | International Electron Devices Meeting
Ching-Wei Chen
C. S. Liu
C. H. Lee
H.Y. Tsai
Han-Ping Pu
K.C. Hsu
H.J. Kuo
M.D. Cheng
Chung-Jung Wu
S.L. Chiu
K.C. Wu
Huan-Neng Chen
Ching-Wen Hsiao
Chih-Hang Tung
M. J. Lii
Douglas Yu
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