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Tulip Chou
Tulip Chou
TSMC
Power cycling
Ball grid array
Flip chip
Materials science
Electronic engineering
3
Papers
9
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Flip chip power cycling system development and lead free bump power cycling reliability
2012
ECTC | Electronic Components and Technology Conference
Max K. C. Wu
H. Y. Pan
Larry Lin
Christine Chiu
Tulip Chou
Gary Lu
Patrick Liu
Gene Wu
Han-Ping Pu
H.Y. Tsai
Bill Kiang
Kenneth Wu
M. J. Lii
C. H. Yu
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Citations (1)
Second-Level Interconnects Reliability for Large-die Flip Chip Lead-Free BGA Package in Power Cycling and Thermal Cycling Tests
2011
Larry C. Lin
Yu-Ling Tsai
Tulip Chou
R.-K.-L. Su
Gary Lu
Max K. C. Wu
Hsin Pan
Han-Ping Pu
Roger Hsieh
Kenneth Wu
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Citations (2)
Second-level interconnects reliability for large-die flip chip lead-free BGA package in power cycling and thermal cycling tests
2011
ECTC | Electronic Components and Technology Conference
Larry Lin
Yu-Ling Tsai
Tulip Chou
Richard Y. X. Su
Guo Cheng Lu
Max K. C. Wu
H. Y. Pan
Huzhe Pu
Roger Hsieh
Kenneth Wu
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Citations (6)
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