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K.C. Wu
K.C. Wu
TSMC
Silicon
Electronic engineering
Optoelectronics
Polymer
Particle
3
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1
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Advanced flip-chip package production solution for 40nm/28nm technology nodes
2010
IEDM | International Electron Devices Meeting
Ching-Wei Chen
C. S. Liu
C. H. Lee
H.Y. Tsai
Han-Ping Pu
K.C. Hsu
H.J. Kuo
M.D. Cheng
Chung-Jung Wu
S.L. Chiu
K.C. Wu
Huan-Neng Chen
Ching-Wen Hsiao
Chih-Hang Tung
M. J. Lii
Douglas Yu
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Method of forming tiny silicon nitride spacer for flash EPROM
2001
H. H. Liu
K.C. Wu
Yuan-Ko Hwang
Shih-Shiung Chen
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Method of controlling wafer surface polarity to reduce spacer particle contamination
2001
K.C. Wu
H. H. Liu
Yuan-Ko Hwang
Shih-Shiung Chen
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