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Ching-Wen Hsiao
Ching-Wen Hsiao
TSMC
Electronic engineering
Physics
Optoelectronics
Composite material
Molding (process)
4
Papers
68
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Alignment mark design for housing
2014
Li-Hsien Huang
Hsien-Wei Chen
Ching-Wen Hsiao
Der-Chyang Yeh
Chen-Hua Yu
Shin-puu Jeng
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Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications
2013
IEDM | International Electron Devices Meeting
Chung-Hao Tsai
Jeng-Shien Hsieh
Monsen Liu
En-Hsiang Yeh
Hsu-Hsien Chen
Ching-Wen Hsiao
Chen-Shien Chen
Chung-Shi Liu
Mirng-Ji Lii
Chuei-Tang Wang
Doug C. H. Yu
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Citations (29)
Advanced flip-chip package production solution for 40nm/28nm technology nodes
2010
IEDM | International Electron Devices Meeting
Ching-Wei Chen
C. S. Liu
C. H. Lee
H.Y. Tsai
Han-Ping Pu
K.C. Hsu
H.J. Kuo
M.D. Cheng
Chung-Jung Wu
S.L. Chiu
K.C. Wu
Huan-Neng Chen
Ching-Wen Hsiao
Chih-Hang Tung
M. J. Lii
Douglas Yu
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Enabling 3D-IC foundry technologies for 28 nm node and beyond: through-silicon-via integration with high throughput die-to-wafer stacking
2009
IEDM | International Electron Devices Meeting
D.Y. Chen
W.C. Chiou
M.F. Chen
T.D. Wang
K.M. Ching
H.J. Tu
W.J. Wu
C.L. Yu
Kuo-Nan Yang
H. B. Chang
M.H. Tseng
Ching-Wen Hsiao
Y.J. Lu
H.P. Hu
You-Ru Lin
C.S. Hsu
Winston Shue
Chung-Yi Yu
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Citations (38)
1