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Kay Peng
Kay Peng
GlobalFoundries
Wafer
Rework
Electronic engineering
Engineering
Photoresist
2
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1
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Defect characterization of 28 nm pitch EUV single patterning structures for iN5 node
2021
Kaushik Sah
Sayantan Das
Andrew Cross
Kay Peng
Kha Tran
Binesh Babu
Ardis Liang
Danilo De Simone
Philippe Leray
Sandip Halder
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Reduction of extra pattern defects in immersion layer reworks by cleans recipe optimization: CFM: Contamination free manufacturing
2016
ASMC | Advanced Semiconductor Manufacturing Conference
Dhiman Bhattacharyya
Wei Hong
Kay Peng
Vincent Sih
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