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Richard Bisson
Richard Bisson
IBM
Composite material
Electronic engineering
Chip-scale package
Dielectric
Materials science
2
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1
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Control and Load Balancing with an IPWR Module to Support Deep Renewables Penetration
2020
Richard Bisson
Jamie Coble
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Challenges of chip-to-package interaction for 22nm technology with ultra low k and Pb-free interconnects
2013
ECTC | Electronic Components and Technology Conference
Chris Muzzy
Richard Bisson
John Cincotta
Danielle Degraw
Edward Engbrecht
J. Gill
Naftali E. Lustig
Karen P. McLaughlin
Sylvain Ouimet
Joseph C. Ross
David Turnbull
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