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Karen P. McLaughlin
Karen P. McLaughlin
IBM
Dielectric
Materials science
Composite material
Electronic engineering
Cracking
2
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5
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0
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Challenges of chip-to-package interaction for 22nm technology with ultra low k and Pb-free interconnects
2013
ECTC | Electronic Components and Technology Conference
Chris Muzzy
Richard Bisson
John Cincotta
Danielle Degraw
Edward Engbrecht
J. Gill
Naftali E. Lustig
Karen P. McLaughlin
Sylvain Ouimet
Joseph C. Ross
David Turnbull
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Role of FBEOL Al pads and hard dielectric for improved mechanical performance in lead-free C4 products
2013
ECTC | Electronic Components and Technology Conference
Ekta Misra
Timothy H. Daubenspeck
Thomas A. Wassick
Krishna Tunga
David L. Questad
G. Osborne
Timothy M. Shaw
Karen P. McLaughlin
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Citations (4)
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