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Sven Kosgalwies
Sven Kosgalwies
GlobalFoundries
Chip
Back end of line
Electronic engineering
Engineering
Pillar
3
Papers
34
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Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements
2018
Frank Kuechenmeister
Dirk Breuer
Holm Geisler
Bjoern Boehme
Kashi Vishwanath Machani
Michael Hecker
Sven Kosgalwies
Jae Kyu Cho
Dongming He
Xuefeng Zhang
Lily Zhao
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CPI challenges to BEOL at 28nm node and beyond
2012
IRPS | International Reliability Physics Symposium
Vivian W. Ryan
Dirk Breuer
Holm Geisler
Dimitri Kioussis
Matthias Lehr
Jens Paul
Kashi Vishwanath Machani
Chirag Shah
Sven Kosgalwies
Lothar Lehmann
Jaesik Lee
Frank Kuechenmeister
E. Todd Ryan
Kamal Karimanal
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Chip-package interaction: Challenges and solutions to mechanical stability of Back end of Line at 28nm node and beyond for advanced flip chip application
2012
EPTC | Electronics Packaging Technology Conference
Frank Kuechenmeister
Dirk Breuer
Holm Geisler
Jens Paul
Chirag Shah
Kashi Vishwanath Machani
Sven Kosgalwies
Rahul Agarwal
Shan Gao
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Citations (17)
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