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Dongming He
Dongming He
Qualcomm
Back end of line
Composite material
Materials science
Pillar
Data collection
4
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3
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0
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Aluminum Pad Plasticity-Related Bump Failure During Temperature Cycling
2021
ECTC | Electronic Components and Technology Conference
Wei Wang
Dongming He
David Fraser Rae
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Numerical Model for Understanding Failure Mechanism of Back End of Line (BEOL) in Bump Shear
2020
ECTC | Electronic Components and Technology Conference
Wei Wang
Wei Zhao
Mark Nakamoto
Mark Schwarz
Dongming He
Xuefeng Zhang
Lily Zhao
Ahmer Syed
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Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements
2018
Frank Kuechenmeister
Dirk Breuer
Holm Geisler
Bjoern Boehme
Kashi Vishwanath Machani
Michael Hecker
Sven Kosgalwies
Jae Kyu Cho
Dongming He
Xuefeng Zhang
Lily Zhao
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Design and assembly process effects on lead free solder joint reliability of bare die and lidded flip chip ball grid array packages
2015
ECTC | Electronic Components and Technology Conference
Dongming He
Brian Roggeman
Eric Zhou
Jiantao Zheng
Pat Holmes
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