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Dirk Wuensch
Dirk Wuensch
Chemnitz University of Technology
Materials science
Nanotechnology
Wafer bonding
Wafer
Engineering physics
4
Papers
9
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Multi-wafer Bonding, Stacking and Interconnecting of Integrated 3-D MEMS Micro Scanners
2014
Maik Wiemer
Dirk Wuensch
Jörg Frömel
Thomas Gessner
Sylwester Bargiel
Maciej Baranski
Nicolas Passilly
Christophe Gorecki
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Plasma‐Activated Bonding
2012
Maik Wiemer
Dirk Wuensch
Joerg Braeuer
Thomas Gessner
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Mechanical characterization of glass frit bonded wafers
2012
Klaus Vogel
Dirk Wuensch
S. Uhlig
Joerg Froemel
Falk Naumann
Maik Wiemer
Thomas Gessner
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Developments Trends in the Field of Wafer Bonding Technologies
2008
Maik Wiemer
Marco Haubold
Chenping Jia
Dirk Wuensch
Joerg Froemel
Thomas Gessner
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Citations (1)
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