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Thiagarajan Raman
Thiagarajan Raman
GlobalFoundries
Materials science
Chip
Electronic engineering
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Mechanical engineering
3
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1
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Utilizing Thermo-Mechanical CPI Simulation to Define a 7nm Package Envelope
2018
Electronics System-integration Technology Conference
Thiagarajan Raman
Scott Pozder
Carole Graas
Himani Kamineni
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BEoL Layout Design Considerations to Mitigate CPI Risk
2018
IITC | International Interconnect Technology Conference
Mohamed A. Rabie
Thiagarajan Raman
Fahad Mirza
Nicholas A. Polomoff
Danish Faruqui
Scott Pozder
Khaled Hassan
Tamer Desouky
Carole Graas
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Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control
2018
Sohan Singh Mehta
Marco Yeung
Fahad Mirza
Thiagarajan Raman
Travis S. Longenbach
Justin Morgan
Mark Duggan
Rio A. Soedibyo
Sean Reidy
Mohamed A. Rabie
Jae Kyu Cho
C. S. Premachandran
Danish Faruqui
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