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Danish Faruqui
Danish Faruqui
GlobalFoundries
Materials science
Chip
Pillar
Stress concentration
Polyimide
2
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1
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BEoL Layout Design Considerations to Mitigate CPI Risk
2018
IITC | International Interconnect Technology Conference
Mohamed A. Rabie
Thiagarajan Raman
Fahad Mirza
Nicholas A. Polomoff
Danish Faruqui
Scott Pozder
Khaled Hassan
Tamer Desouky
Carole Graas
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Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control
2018
Sohan Singh Mehta
Marco Yeung
Fahad Mirza
Thiagarajan Raman
Travis S. Longenbach
Justin Morgan
Mark Duggan
Rio A. Soedibyo
Sean Reidy
Mohamed A. Rabie
Jae Kyu Cho
C. S. Premachandran
Danish Faruqui
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