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S. Fehlberg
S. Fehlberg
Technical University of Berlin
Electronic engineering
Chip
Flip chip
Engineering
Electronic packaging
5
Papers
81
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Fab Integrated Packaging (FIP): a new concept for high reliability wafer-level chip size packaging
2000
ECTC | Electronic Components and Technology Conference
M. Topper
J. Auersperg
V. Glaw
K. Kaskoun
E. Prack
B. Keser
P. Coskina
D. Jager
D. Fetter
O. Ehrmann
K. Samulewicz
C. Meinherz
S. Fehlberg
C. Karduck
Herbert Reichl
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Citations (37)
Wafer-level chip size package (WL-CSP)
2000
ECTC | Electronic Components and Technology Conference
M. Topper
S. Fehlberg
K. Scherpinski
C. Karduck
V. Glaw
K. Heinricht
P. Coskina
Oswin Ehrmann
Herbert Reichl
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Citations (6)
Wafer level package using double balls
2000
APMPPI | International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces
Michael Töpper
V. Glaw
P. Coskina
J. Auersperg
K. Samulewicz
M. Lange
C. Karduck
S. Fehlberg
O. Ehrmann
Herbert Reichl
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Citations (15)
Fabrication of a High-Density MCM-D for a Pixel Detector System using a BCB/Cu/PbSn Technology
1999
The International journal of microcircuits and electronic packaging
Michael Töpper
L. Dietrich
G. Engelmann
S. Fehlberg
P. Gerlach
Juergen Wolf
O. Ehrmann
K.-H. Becks
Herbert Reichl
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Citations (5)
Chip size package : The option of choice for miniaturized medical devices
1998
M Topper
M. Schaldach
S. Fehlberg
C. Karduck
C. Meinherz
K. Heinricht
V. Bader
L. Hoster
P. Coskina
A. Kloeser
O. Ehrmann
Herbert Reichl
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Citations (18)
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