Old Web
English
Sign In
Acemap
>
authorDetail
>
C. Meinherz
C. Meinherz
Technical University of Berlin
Electronic engineering
chip size
Chipset
Embedded system
SMT placement equipment
3
Papers
72
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Fab Integrated Packaging (FIP): a new concept for high reliability wafer-level chip size packaging
2000
ECTC | Electronic Components and Technology Conference
M. Topper
J. Auersperg
V. Glaw
K. Kaskoun
E. Prack
B. Keser
P. Coskina
D. Jager
D. Fetter
O. Ehrmann
K. Samulewicz
C. Meinherz
S. Fehlberg
C. Karduck
Herbert Reichl
Show All
Source
Cite
Save
Citations (37)
Chip Size Package - The Option of Choice for Miniaturized Medical Devices
1998
Michael Toepper
C. Karduck
C. Meinherz
L. Hoster
P. Coskina
Herbert Reichl
M. Schaldach
S. Fehlberg
K. Heinricht
V. Bader
A. Kloeser
Oswin Ehrmann
Show All
Source
Cite
Save
Citations (17)
Chip size package : The option of choice for miniaturized medical devices
1998
M Topper
M. Schaldach
S. Fehlberg
C. Karduck
C. Meinherz
K. Heinricht
V. Bader
L. Hoster
P. Coskina
A. Kloeser
O. Ehrmann
Herbert Reichl
Show All
Source
Cite
Save
Citations (18)
1