Old Web
English
Sign In
Acemap
>
authorDetail
>
David Lewison
David Lewison
Flip chip
Materials science
Dielectric
Electronic engineering
Design for manufacturability
2
Papers
1
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (2)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Pure Chemical Reduction of Tin Oxides to Metallic Tin by Atmospheric Plasma to Improve Interconnection Reflow of Pb-free Solders
2015
Kang Wook Lee
Katsuyuki Sakuma
Thomas E. Lombardi
Jason Rowland
David Lewison
Eric Schulte
Show All
Source
Cite
Save
Citations (0)
Large Laminate and Die Coreless Substrate Packaging with Lid Ties
2014
Edmund Blackshear
Brian W. Quinlan
Benjamin V. Fasano
David Lewison
Shidong Li
Hugues C Gagnon
Paul Fortier
Richard Heath
Frederick Roy
Elaine Cyr Takashi Nakajima
Yoichi Miyazawa
Itsuroh Shishido
Tomoyuki Yamada
Show All
Source
Cite
Save
Citations (1)
1