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Brian W. Quinlan
Brian W. Quinlan
IBM
Materials science
Electronic engineering
Flip chip
Composite material
Ceramic
2
Papers
1
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0
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Finite Element Modeling of C4 Cracking in a Large Die Large Laminate Coreless Flip Chip Package
2016
ECTC | Electronic Components and Technology Conference
Shidong Li
Tuhin Sinha
Thomas A. Wassick
Thomas E. Lombardi
Charles L. Reynolds
Brian W. Quinlan
Sushumna Iruvanti
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Large Laminate and Die Coreless Substrate Packaging with Lid Ties
2014
Edmund Blackshear
Brian W. Quinlan
Benjamin V. Fasano
David Lewison
Shidong Li
Hugues C Gagnon
Paul Fortier
Richard Heath
Frederick Roy
Elaine Cyr Takashi Nakajima
Yoichi Miyazawa
Itsuroh Shishido
Tomoyuki Yamada
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