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Chanmi Lee

Electronics and Telecommunications Research Institute

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Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology

2021 ECTC | Electronic Components and Technology Conference
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59-5: Simultaneous Transfer and Bonding (SITRAB) Process for Mini-LED Display

2021
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Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive

2021 ECTC | Electronic Components and Technology Conference
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Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining.

2021 Polymers
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