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Liao Jinzhi Lois
Liao Jinzhi Lois
Composite material
Materials science
Wire bonding
Copper
Aluminium
5
Papers
1
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0
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2024
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Enhancing High Temperature Adhesion Performance Via a Renovated Leadframe Surface Treatment
2020
CSTIC | China Semiconductor Technology International Conference
Din-Ghee Neoh
Tee Weikok
Liao Jinzhi Lois
Jia Wenping
Yee Boonhwa
Boon-Seong Lee
Wang Bisheng
Zhang Xi
Hua Younan
Li Xiaomin
Mario Strauch
Boon-Chye Lee
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bHAST, PCT, TCT reliability performance comparison of Cu-Al, PdCu-Al, Ag-Al
2020
EPTC | Electronics Packaging Technology Conference
Liao Jinzhi Lois
Tee Weikok
Yu Minglang
Wang Bisheng
Zhang Xi
Yee Boonhwa
Li Xiaomin
Hua Younan
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Comprehensive Comparison of the Wire Bond Reliability Performance of CU, PDCU and AG Wires
2020
CSTIC | China Semiconductor Technology International Conference
Liao Jinzhi Lois
Yu Minglang
Tee Weikok
Wang Bisheng
Jia Wenping
Yee Boonhwa
Zheng HaiPeng
Zhang Xi
Fu Chao
Li Xiaomin
Hua Younan
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Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contaminations
2019
EPTC | Electronics Packaging Technology Conference
Liao Jinzhi Lois
Mao Songlin
Wang Bisheng
Zheng HaiPeng
Zhang Xi
Li Xiaomin
Hua Younan
Fu Chao
Tee Weikok
Yee Boonhwa
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Characterization of interfacial intermetallic compounds in gold wire bonding with copper pad
2018
EPTC | Electronics Packaging Technology Conference
Wang Bisheng
Liao Jinzhi Lois
Li Xiaomin
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