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Tien-Yu
Tien-Yu
Delamination
Electronic engineering
Dielectric
Engineering
Copper
3
Papers
80
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an Escherichia coli K12 proteome chip
2014
Yi-Wen Chen
Ching Hao Teng
Yu-Hsuan Ho
Tien-Yu
Jessica Ho
Wen-Chun Huang
Masayuki Hashimoto
I-Yuan Chiang
Chien-Sheng Chen
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Investigations into thermoluminescence and afterglow characterization of strontium aluminates with boron-modification and reductions via sol-gel route
2012
I-Chemg
Chen
Ker Kong
Hong Sen
Je Kang
Du
Tsao-Jen
Lin
Shiu-Shiung
Teng-Ming
Tien-Yu
Shieh
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Citations (4)
Analysis of flip-chip packaging challenges on copper/low-k interconnects
2003
IEEE Transactions on Device and Materials Reliability
L.L. Mercado
C. Goldberg
Shun-Meen Kuo
Tien-Yu
Tom Lee
S.K. Pozder
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Citations (76)
1