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C. Goldberg
C. Goldberg
Intel
Delamination
Electronic engineering
Dielectric
Engineering
Copper
1
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76
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Analysis of flip-chip packaging challenges on copper/low-k interconnects
2003
IEEE Transactions on Device and Materials Reliability
L.L. Mercado
C. Goldberg
Shun-Meen Kuo
Tien-Yu
Tom Lee
S.K. Pozder
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Citations (76)
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