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Xiangqing You
Xiangqing You
University of Electronic Science and Technology of China
Composite material
Copper
Copper plating
Printed circuit board
Surface tension
3
Papers
5
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0
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Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board
2021
Journal of Materials Science: Materials in Electronics
Yuanming Chen
Lingzhi Zhang
Jiaying Xu
Jianrong Fang
Xiangqing You
Zhengdong Tan
Haiying Wang
Guoyun Zhou
Shouxu Wang
Wei He
Yuyao Luo
Yiling Ye
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Surface coarsening of carbon fiber/cyanate ester composite for adhension impovement of electroless copper plating as conductive patterns
2020
Materials Chemistry and Physics
Xiangqing You
Yuanming Chen
Yunzhong Huang
Chong Wang
Guoyun Zhou
Wei He
Shouxu Wang
Yao Tang
Weihua Zhang
Zhiqiang Li
Ping Tang
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Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board
2019
Vacuum
Yan Hong
Xiangqing You
Yi Zeng
Yuanming Chen
Yunzhong Huang
Wei He
Shouxu Wang
Chong Wang
Guoyun Zhou
Xinhong Su
Weihua Zhang
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