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Wei-Kuo Han
Wei-Kuo Han
Industrial Technology Research Institute
Materials science
Power module
Electronic engineering
Insulated-gate bipolar transistor
Junction temperature
7
Papers
10
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Packaging reliability estimation of high-power device modules by utilizing silver sintering technology
2020
Microelectronics Reliability
Chang-Chun Lee
Kuo-Shu Kuo
Chi-Wei Wang
Chang Jing-Yao
Wei-Kuo Han
Tao-Chih Chang
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A Novel All-in-One Digital-Analog Heterogeneous Integrated Intelligent Power Module
2019
ISPSD | International Symposium on Power Semiconductor Devices and IC's
Y. T. Lin
Kuo-Shu Kao
Chih-Ming Tzeng
H.H. Lin
Wei-Kuo Han
June-Chien Chang
T. C. Chang
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Development of high performance synchronous rectifier module by multi-chip Cu sintering technology (IMPACT 2018)
2018
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
J.Y. Chang
Su-Yu Fun
K. H. Cheng
H.W. Cheng
H.H. Lin
Wei-Kuo Han
S.F Hsu
C. M. Tseng
Tao-Chih Chang
K. Anai
S. Yamauchi
J. L. Jo
T Sakaue
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Characteristics of 600 V / 450 A IGBT module assembled by Ag sintering technology
2014
ICEP | International Conference on Electronics Packaging
Jing-Yao Chang
Su-Yu Fun
Fang-Jun Leu
Kuo-Shu Kao
Chih-Ming Tzeng
Wei-Kuo Han
Tao-Chih Chang
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Citations (3)
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