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H.H. Lin
H.H. Lin
Industrial Technology Research Institute
Electronic engineering
Materials science
Power module
Chip
Thermal resistance
5
Papers
2
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0
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A Novel All-in-One Digital-Analog Heterogeneous Integrated Intelligent Power Module
2019
ISPSD | International Symposium on Power Semiconductor Devices and IC's
Y. T. Lin
Kuo-Shu Kao
Chih-Ming Tzeng
H.H. Lin
Wei-Kuo Han
June-Chien Chang
T. C. Chang
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Development of high performance synchronous rectifier module by multi-chip Cu sintering technology (IMPACT 2018)
2018
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
J.Y. Chang
Su-Yu Fun
K. H. Cheng
H.W. Cheng
H.H. Lin
Wei-Kuo Han
S.F Hsu
C. M. Tseng
Tao-Chih Chang
K. Anai
S. Yamauchi
J. L. Jo
T Sakaue
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Thermal Simulation and Measurement for EV charger Full SiC Power Module
2018
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
P.K. Chiu
Hung-Kun Lee
Sheng-Tsai Wu
Chih-Ming Tzeng
H.H. Lin
Yu-Chung Chen
Fang-Jun Leu
T.T Lin
Yu-Sheng Lin
Chun Kai Liu
Tao-Chih Chang
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A high efficient synchronous rectifier for next generation automotive alternator applications
2018
ICEP | International Conference on Electronics Packaging
Kuo-Shu Kao
H.H. Lin
W. K. Han
S. T. Wu
C. M. Tseng
T.J. Yu
P.K. Chiu
Y. T. Lin
S.F Hsu
J.Y. Chang
Tao-Chih Chang
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The Development of High Thermal Dissipation Intelligent Power Module Packaging Technology
2018
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
T.J. Yu
Kuo-Shu Kao
J.Y. Chang
H.H. Lin
P.K. Chiu
Fang-Jun Leu
Tao-Chih Chang
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