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Gaurav Sharma
Gaurav Sharma
STATS ChipPAC Ltd
Wafer-level packaging
Electronic engineering
Wafer
Engineering
Embedded system
5
Papers
73
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Process and Reliability of Embedded Micro-Wafer-Level Package (EMWLP) Using Low Cure Temperature Dielectric Material
2012
IEEE Transactions on Components, Packaging and Manufacturing Technology
Vempati Srinivas Rao
Vasarla Nagendra Sekhar
Ho Soon Wee
Ranjan Rajoo
Gaurav Sharma
Lim Ying Ying
Pinjala Damaruganath
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Solutions Strategies for Die Shift Problem in Wafer Level Compression Molding
2011
IEEE Transactions on Components, Packaging and Manufacturing Technology
Gaurav Sharma
Aditya Kumar
Vempati Srinivas Rao
Soon Wee Ho
V. Kripesh
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Reliability and failure analysis study of multi-die embedded micro wafer level packages
2010
EPTC | Electronics Packaging Technology Conference
Vasarla Nagendra Sekhar
Vempati Srinivasa Rao
Gaurav Sharma
Ranjan Rajoo
Serene Thew Mei Ling
Khong Chee Houe
Chong Ser Choong
Cheng Cheng Kuo
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Performance & reliability characterization of eWLB (embedded wafer level BGA) packaging
2010
EPTC | Electronics Packaging Technology Conference
Gaurav Sharma
Seung Wook Yoon
Meenakshi Prashant
Roger Emigh
Sin-Jae Lee
Kai Liu
Rajendra Pendse
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High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)
2010
IEEE Transactions on Advanced Packaging
Ying Ying Lim
Xianghua Xiao
Srinivasa Rao Vempati
Nandar Su
Aditya Kumar
Gaurav Sharma
Teck Guan Lim
Kripesh Vaidyanathan
Jinglin Shi
John H. Lau
Shiguo Liu
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Citations (22)
1