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Rajendra Pendse
Rajendra Pendse
Wafer
Electronic engineering
Interconnection
Materials science
Polymer science
4
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9
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0
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The International Magazine for Device and Wafer-level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century.
2014
Rajendra Pendse
Seung Wook Yoon
Kang Chen
Linda Chua
Yaojian Lin
Amer Cassier
Lily Zhao
Ahmer Syed
Steve Bezuk
William Miller Qualcomm
Amy Leong
James McLeish
Randy Schueller
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Performance & reliability characterization of eWLB (embedded wafer level BGA) packaging
2010
EPTC | Electronics Packaging Technology Conference
Gaurav Sharma
Seung Wook Yoon
Meenakshi Prashant
Roger Emigh
Sin-Jae Lee
Kai Liu
Rajendra Pendse
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Dispositif et procede d'encapsulation precise d'interconnexions de puces a protuberances
2002
Rajendra Pendse
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Structure d'interconnexion par billes
2001
Rajendra Pendse
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