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Marvin Liao
Marvin Liao
TSMC
Materials science
Chip
Wafer
Composite material
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3
Papers
2
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2024
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The Analysis for Bump Resistance Improvement by Optimizing the Sputter Condition
2019
ECTC | Electronic Components and Technology Conference
Ming-Sin Su
Chang-Ning Wang
Clair Tsai
T. L. Yang
Rolance Yang
W.C. Wu
C. S. Liu
J. M. Chiu
Y. F. Chen
Ponder Pang
Harry Ku
Kirin Wang
C. H. Su
Steven Hsu
Calvin Lu
K. C. Liu
Marvin Liao
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Comprehensive Solution for Micro Bump Coplanarity Control
2019
ECTC | Electronic Components and Technology Conference
Chun-Chen Liu
Ji-Jan Chen
Yu-Nu Hsu
Rung-De Wang
Yu-Cheng Wang
Bin-En Ho
Y.H. Wu
Ponder Pan
Harry Ku
Kirin Wang
Calvin Lu
K. C. Liu
Marvin Liao
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C4 Compatible Ultra-Thick Cu On-chip Magnetic Inductor Architecture Integrated with Advanced Polymer/Cu Planarization Process
2019
ECTC | Electronic Components and Technology Conference
Cheng-Yu Kuo
S. B. Yang
C.-C. Kuo
Yi-huan Chen
K.S. Yuan
G. C. Huang
C.N. Ke
Grace Chang
C. C. Hsu
H. L. Huang
Kirin Wang
Harry Ku
Ching-Fang Chen
K. C. Liu
Alex Kalnitsky
Marvin Liao
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