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Rung-De Wang
Rung-De Wang
TSMC
Flip chip
Electronic engineering
Thin film
Copper
Engineering
2
Papers
1
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2024
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Comprehensive Solution for Micro Bump Coplanarity Control
2019
ECTC | Electronic Components and Technology Conference
Chun-Chen Liu
Ji-Jan Chen
Yu-Nu Hsu
Rung-De Wang
Yu-Cheng Wang
Bin-En Ho
Y.H. Wu
Ponder Pan
Harry Ku
Kirin Wang
Calvin Lu
K. C. Liu
Marvin Liao
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Cu/Ni interface study for bump reliability improvement
2013
ASMC | Advanced Semiconductor Manufacturing Conference
Rung-De Wang
Chen-Hsun Liu
Yu-Nu Hsu
Justin Lo
Chin-Yu Ku
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