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Jan Abraham Ferreira
Jan Abraham Ferreira
University of Twente
Materials science
Power semiconductor device
Engineering physics
Power module
Electronic engineering
2
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Interleaved Planar Packaging Method of Multichip SiC Power Module for Thermal and Electrical Performance Improvement
2021
IEEE Transactions on Power Electronics
Fengtao Yang
Jia Lixin
Laili Wang
Fan Zhang
Binyu Wang
Cheng Zhao
Jianpeng Wang
Christoph Friedrich Bayer
Jan Abraham Ferreira
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The Impact of ITRW: How can WBG power semiconductors break through
2021
Jan Abraham Ferreira
Peter R. Wilson
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